Tongfu Microelectronics Co., Ltd, TFME
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TFME is a corporation specializing in IC assembling and testing, and is China top three IC Package and Test Enterprise. In 2016, TFME ranked 8th globally. Home Directory ElectronicSystemDesign PackagingServices,OSAT TongfuMicroelectronicsCo.,Ltd,TFME TongfuMicroelectronicsCo.,Ltd,TFME OSAT(outsourcedsemiconductorassemblyandtest)company. China Manufacturer,ServiceCompany Information Сategories News Downloads Products OnAugust16,2007,TongFuMicroelectronicsCo.,Ltd.whichwasestablishedinOctober1997,becamealistedcompanyinShenzhenStockExchange.Thestocknameis“TongFuWeiDian”withcode002156.Thecompanyhas2majorshareholders.OneisNantongHuadaMicroelectronicsGroupLtd.(holding31.25%)andtheotherisFujitsu(China)Limited(holding21.38%).Thereare972,630,000sharesintotalpossessedbythecompany. TFMEisacorporationspecializinginICassemblingandtesting,andisChinatopthreeICPackageandTestEnterprise.In2016,TFMEranked8th globally.TheheadquarterislocatedinChongchuanZone,Nantong,JiangsuProvince.TFMEhave6productionbase:Headquarter、 NantongTongfu,HefeiTongfu,TF-AMDSuz,TF-AMDPenang,XiamenTongfu.Throughdevelopmentandacquisition,TFMEhasbecomethelocalsemiconductormultinationalcorporationandtheleaderofChinaICPackageandTestIndustry.Atpresent,therearemorethan10,000employees. Atpresent,TFMEownsseveralpackagingtechniquesuchas:AdvancedPackage&TesttechnologysuchasBumping、WLCSP、FC、BGA、SiPetc.,TraditionalPackage&TesttechnologysuchasQFN、QFP、SOetc.,AutomotiveElectronicsProductsandMEMSetc.;Testingtechniquesuchas:WaferTestandSystemTest.Amongdomesticpackageandtestcorporations,TFMEisthefirstonetorealizethemassproductionof12inch28nmmobilephoneprocessorchipbackendprocess,includingBumping、CP、FC、FT、SLTandsoon.Morethan50%ofglobaltoptensemiconductormanufacturersareourmajorcustomers. TFMEhasseveralhigh-levelR&DplatformsuchasNationalEnterpriseTechnologyCenter,NationalPostdoctoralScientificResearchStation,JiangsuEnterpriseAcademicianWorkStation,ProvincialEngineeringandTechnologicalResearchCenterandEnterpriseresearchinstitute.TFMEalsohasaprofessionaltechnicalteamformedbymorethan2000people. Asanationalandprovincialhightechnologycorporation,TFMEalwaysstandsintheforefrontofindustryscienceandtechnologydevelopment,andadherestotheideaofachievingimprovementwithscienceandtechnology.Duringthepastyears,TFMEhasundertakenandcompletedmanynationalandprovincialtechnologicalreformprojects,suchas“02SpecialProject”,andgotnationalspecialfundswhichworthseveralbillions.DozensofproducttechnologyhavebeenawardedasChinaSemiconductorInnovativeProductandTechnology、NationalKeyproduct、JiangsuProvinceHigh-techProductandJiangsuProvinceScienceandTechnologyawardsetc. Muchearlierthanitsrivals,thecompanyalsopassedthreeinternationalmanagementsystemcertifications,includingISO9001,ISO14001&ISO/TS16949.ByusingSAP、MES、EquipmentAutomation、EDIetc.,TFMEcancommunicatewithcustomerinrealtimeaspercustomer’spersonalizedstandardauto-controlproductiveprocess.Throughimplementing“TFMEIndustry4.0”Project,entirelybuildthesmartplantbasedonInternetofThingsandsetuptheflexibleautomationassemblyline.Thus,wecancreateaWin-Winsituationfortheclients. ThecompanywasestablishedinOctoberof1997.Atpresent,therearemorethan4000employees.Asanationalandprovincialhightechnologycorporation,TFMEalwaysstandsintheforefrontofindustryscienceandtechnologydevelopment,andadherestotheideaofachievingimprovementwithscienceandtechnology.Duringthepastyears,TFMEhasundertakenandcompletedmanynationalandprovincialtechnologicalreformprojects,whicheffectivelypromotedtheindustrializationofadvancedassy&testtechnologiesinChina.Muchearlierthanitsrivals,thecompanyalsopassedthreeinternationalmanagementsystemcertifications,includingISO9001,ISO14001&ISO/TS16949. PackagingServices,OSAT Assembly PackageMat'ls;Interconnect;SubassemblyDesignSvcs ManufacturingServicesorConsulting WaferBumpingService ManufacturingServices NonVerifided ClaimYourCompany China Website http://www.tfme.com/ SendDirectmessage ASETechnologyHolding,Co.,LtdTaiwan NadaTechnologies,Inc.AustinUnitedStates NanmatTechnologyCo.,Ltd.KaohsiungCityTaiwan GLOBALUNICHIPCORP.(GUC)Taiwan SiliconSpecialists,LLCUnitedStates ValleyDesignUnitedStates AdvancedMicroFoundrySingapore LioniXInternationalNetherlands Directory News Jobs Forum Marketplace
延伸文章資訊
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TFME. 通富微电拥有Bumping、WLCSP、FC、BGA、SiP等先进封测技术,QFN、QFP、SO等传统封测技术以及汽车电子产品、MEMS等封测技术;以及圆片测试、系统测试等测试技术。
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